Intel recently announced that its 300-series chipset will be transferred from Chengdu, China, to the factory in Ho Chi Minh City, Vietnam from July 12, and the future 300-series chipsets will become “Made in Vietnam”, replacing the current “Made in China”. .

Intel has factories all over the world, and the division of labor varies from place to place. The core wafer manufacturing is mainly in the United States, Ireland and Israel. The packaging and testing plants are mainly in Asia, including Chengdu, China, Ho Chi Minh, Vietnam and Penang, Malaysia. There are also packaging plants in Costa Rica and Dalian, China, but the former has been closed. The latter has turned to 3D NAND flash production.

Intel's packaging plant for the 300 series chipset is mainly related to Q370, C246, HM370, QM370, CM246 and H310. The transfer test and test factory has no change in performance and specifications. The main influence is the origin information on the label. It used to be “Made in China” and later “Made in Vietnam”.

As for the reason why Intel migrated the packaging factory, there is no official explanation for the time being. But it is not difficult to guess that this is related to Sino-US trade disputes.