Technologies

News information
Prophesee launches first event-based industrial vision sensor 7 окт. 2019 г.

Considered to be a significant improvement over traditional frame-based vision methods, it will be applied to next-generation vision technologies in industrial automation and IoT systems.

Honeywell Introduces New Compact MEMS IMU for High-Precision Navigation 30 сент. 2019 г.

This compact sensor can withstand harsh air, land or underwater environments and serves markets such as agriculture, robotics, mapping, driverless cars and transportation.

Intel released new solid state drive 665p, QLC flash density increased 28 сент. 2019 г.

Intel 665p uses the same Huirong SM2263 four-channel controller as 660p, but innovated on NAND granules for Intel's second-generation 96-layer stack 3D QLC particles.

ROHM introduces new car-level LED driver IC that supports 12-inch LCD panels 25 сент. 2019 г.

Unlike traditional 4-channel drivers (supporting 8-inch LCDs), the IC supports 6-channel (120mA per channel) output 10 to 12-inch LCD panels.

The CMOS sensor market is growing rapidly 23 сент. 2019 г.

In the next few years, automotive, security monitoring, medical, toy/video games and industry will become the main driving force for the rapid development of CMOS sensors

NXP launches secure precision ranging chipset SR100T 20 сент. 2019 г.

a secure precision ranging chipset that provides tailored, high-precision positioning performance for the next generation of UWB-enabled mobile devices

STMicroelectronics Releases Low Distortion High Voltage LED Driver 18 сент. 2019 г.

The HVLED007AC/DC uses a new distortion-suppressed input current shaping (ICS) circuit to enable energy-efficient solid-state luminaires to meet increasingly stringent lighting regulations.

China's semiconductor development road is accelerating 14 сент. 2019 г.

After decades of continuous advancement, China has nearly 2,000 chip design related companies.

YMTC began mass production of self-developed 64-layer 3D flash memory (3D NAND) 11 сент. 2019 г.

Innovative Xtacking technology resulting in faster transfer speeds and higher storage densities than traditional 3D flash architectures And a shorter product launch cycle

Korea Semiconductor is developing its own fluorine polyimide material 9 сент. 2019 г.

LG and Samsung are currently working on the development of fluoropolyimide materials

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