Images are for reference only.
See Product Specifications for product details.
| Part Number | BU400Z-178-HT |
|---|---|
| Part Status | Active |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 78.7µin (2.00µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Copper |
| Contact Finish Thickness - Post | Flash |
| Contact Material - Post | Brass |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| Image | Part Number | Manufacturers | Description | In Stock | View | |
|---|---|---|---|---|---|---|
 |
BU4001B | Rohm Semiconductor | IC GATE NOR 4CH 2-INP 14-DIP | 0 | Details | |
 |
BU4001BF-E2 | Rohm Semiconductor | IC GATE NOR 4CH 2-INP 14-SOP | 2500 | Details | |
 |
BU400Z-178-HT | On Shore Technology Inc. | CONN IC DIP SOCKET 40POS GOLD | 194 | Details |