According to supply chain news, Taiwan's semiconductor manufacturing company TSMC has launched two technologies designed for customers who need fast operation and lower power consumption, N7P technology and N5P technology. It is understood that N7P is an enhanced version of 7nm deep ultraviolet (N7/DUV), while N5P is an enhanced version of 5nm extreme ultraviolet (N5/EUV).
Its N7P and N5P technologies are designed for customers who need to run faster and consume less power. Although the design rules for the N7P and N7 are the same, the new process optimizes the front-end (FEOL) and mid-range (MOL) processes to increase performance by 7% at the same power or 10% at the same frequency.
At the 2019VLSI seminar held in Japan, TSMC revealed which customers have access to new technology, but the company does not seem to have a widely advertised idea.
The N7P uses proven deep ultraviolet (DUV) lithography, which does not increase the density of the transistor compared to the N7.
Some TSMC customers who need to increase transistor density by about 18-20% are expected to use TSMC's N7+ and N6 processes, which use EUV lithography for multi-layer processing.
Although N7 and N6 are both "long" nodes in the next few years, TSMC will bring significant density, power and performance improvements to the next N5 node.
After N5, an enhanced version called N5P will be ushered in, supplemented by FEOL and MOL optimization, in order to increase the performance of the chip by 7% at the same power or 15% at the same frequency.
It is understood that this front-end power company has revealed at the 2019VLSI seminar held in Japan that it has been offered a list of customers using the N7P and N5P two new processes, but the customer list is not available to the public. The follow-up may be announced gradually, and everyone can look forward to it.