In today's highly competitive independent distribution market, WinSupport has identified "quality" as one of the most important key factors to achieve sustained customer satisfaction. In 2000, we further reviewed our overall quality management structure to strengthen and improve our quality process to a higher level. We also incorporated new measures into our product inspection process to prevent "product forgery".
Since WinSupport went public, our customer base has been expanding. From the beginning, we have implemented ISO 9001 quality management system, formulated quality mission, quality policy, and established a multi-level inspection process.
Commitment to exceed the expectations of customers and strategic partners by delivering quality products on time.
This is the policy of WinSupport Electronic International Components:
Multi-Level Inspection Process
We have integrated our Quality Assurance System with the following “Traffic-Light Inspection Model” (3 levels: Green, Orange & Red) for incoming inspections.
|Level 1 (Green) : Inspection by the Inspector|
|Basic inspection on manufacturer part number, quantity, ROHS and date code requirements.|
Visual inspection to check on the physical integrity of products (e.g. scratches, gouges, cracks, discoloration, bent or missing leads, etc.) and packaging, including ESD and moisture barrier protection if applicable.
|Authenticity Verification of box packaging, original factory sealed and manufacturing label.|
|Level 2 (Orange) : Verification by the Quality Engineer (QE)|
|The engineer conducts a more rigorous inspection to re-evaluate all related issues raised in Level 1.|
|Detailed inspection on physical product with respect to manufacturer datasheet.|
|Verifies mechanical aspects of the product.|
|Authenticity checking (e.g. body marking etc.).|
|Conduct specific test as per requirement.|
Level 3 (Red) : Testing by a External Test House
|Solderability Tests to identify any lead contamination.|
|Electrical Tests to verify component functionality to manufacturers’ specifications|
|X-Ray & Decapsulation Test to check the authenticity of the manufacturer’s die and/or wafer.|