20-823-90

CONN IC DIP SOCKET 20POS GOLD
20-823-90 P1
20-823-90 P2
20-823-90 P3
20-823-90 P1
20-823-90 P2
20-823-90 P3
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Aries Electronics ~ 20-823-90

Part Number
20-823-90
Manufacturer
Aries Electronics
Description
CONN IC DIP SOCKET 20POS GOLD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data sheet
20-823-90.pdf 20-823-90 PDF online browsing
Family
Sockets for ICs, Transistors
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Product Parameter

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Part Number 20-823-90
Part Status Active
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 20 (2 x 10)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10µin (0.25µm)
Contact Material - Mating Phosphor Bronze
Mounting Type Through Hole, Right Angle, Horizontal
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 10µin (0.25µm)
Contact Material - Post Phosphor Bronze
Housing Material Polyamide (PA46), Nylon 4/6
Operating Temperature -

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