(Reported by Electronic Enthusiast Network / Zhang Ying) The progress of photolithography machines and photoresists has always been the focus of attention in the semiconductor industry. As we all know, the photolithography process...
According to Omdia's 2020 report, the total size of the AI inferred market in 2020 is 5 billion U.S. dollars and is expected to reach 7 billion U.S. dollars this year. Xilinx predicts that the AI inferred market will grow at a...
September 8, 2021, Shanghai, China — SmartSens, a supplier of advanced CMOS image sensors, officially launched a full range of upgraded image sensors equipped with DSI-2 technology-SC2336 and SC3336, with high-quality video The so...
Since the United States imposed technical sanctions and equipment suppression against domestic semiconductor manufacturers; every step regarding the core technology of domestic integrated circuit chips has been paid attention to b...
ESP8266 serial port WIFI module CH340/CP2102 NodeMCU Lua V3 IoT development board
Among mobile phone chips, the most powerful chip belongs to Apple's A series. After Samsung, Qualcomm and others release new processors, their performance is often slightly behind Apple. On the one hand, it is because Apple's sel...
In the past, when designing a product, you must first plan the hardware architecture. After the hardware design is completed, the development of the software part will begin, and then the complete product will be released. Now, wi...
There are more and more news about Apple's autumn conference. According to the news, this year's iPhone conference may be scheduled in the middle of this month. In addition to the release of the iPhone 13 series, it will also brin...
In March 2019, the Ministry of Transport of the People’s Republic of my country issued JT/T 1178.2, which is the "Operating Truck Safety Technical Regulations Part 2: Towing Vehicles and Trailers", which stipulates that from May 1...
Ignion’s proprietary Virtual Antenna™ technology simplifies the complex antenna and RF design, testing, and assembly processes into software-defined configuration and surface mount processes based on miniaturization, standardizati...