According to Hong Kong's "Ta Kung Pao" recently reported, Yangtze Memory Technologies Co., Ltd. ("YMTC") official website news, on the eve of the Shanghai China International Semiconductor Expo, the company announced that it has begun mass production of 64-layer "third-order storage unit" based on XtackingR architecture. 3D NAND flash memory with a capacity of 256Gb to meet the needs of mainstream market applications such as solid state drive (SSD) embedded storage, which is also China's first 64-layer 3D flash memory chip. According to reports, the mass production of YMTC 64-layer 3D flash memory products is expected to increase the self-yield of Chinese memory chips from 8% to 40%.
The so-called 3D NAND is to provide a multi-layer structure to provide capacity by stacking the originally tiling storage units, so that the storage unit having only one layer is stacked into 64 layers or more.
According to the report, YMTC64 layer 3D flash memory is the world's first flash memory product based on Xtacking architecture and mass production, with the highest storage density in its generation. Innovative Xtacking technology allows two wafers to be bonded through billions of Vertical Interconnect Channels (VIAs) in a single processing step, resulting in faster transfer speeds and higher storage densities than traditional 3D flash architectures And a shorter product launch cycle.
The storage chips are highly competitive, and giants such as Samsung, Hynix, Toshiba, Western Digital, Micron, and Intel continue to invest in production capacity. In 2018, 64-layer and 72-layer 3D NAND flash memory is already the main product. In 2019, mass production of 92-layer and 96-layer products will begin. By 2020, large manufacturers will soon enter mass production of 128-layer 3D NAND flash memory.
The industry predicts that YMTC will skip the 96-story layer and enter the 128-layer 3D flash memory as soon as possible to achieve the overtaking of the curve. It is reported that YMTC has launched the Xtacking2.0 plan to improve NAND throughput rate, improve the overall performance of system-level storage, and open a new business model of customized NAND. The related products will be widely used in data centers, enterprise servers, personal computers and Mobile devices and other fields.